S. Merino, A. Retolaza, H. Schift, V. Trabadelo.
Stamp deformation and its influence on residual layer homogeneity in thermal nanoimprint lithography
In thermal nanoimprint lithography (NIL), one of the key points to be addressed is the printing uniformity on large areas.
Aldizkaria/Liburua
MicroelectronicEngineering, 85, 877-880 (2008)
2008V. Trabadelo, H. Schift, S. Merino, S. Bellini, J. Gobrecht.
Measurement of demolding forces in full wafer thermal nanoimprint
The Jenoptik HEX03 embossing machine has been used in a slightly modified setup to measure the demolding forces online.
Aldizkaria/Liburua
MicroelectronicEngineering, 85, 907-909 (2008)
2008J. Barriga, B. Fernandez-Diaz, A. Juarros, SIU Ahmed, JL Arana
Microtribological analysis of gold and copper contacts
There are millions of electrical contacts subject to relative motion: connectors, relays, chips in cards, switches… Friction and wear in this kind of devices are still a source of concern.
Aldizkaria/Liburua
Tribology International
2007-10
Orrialdeak
10/2007; 40(10-12):1526-1530
J. Barriga, B. Coto, B. Fernandez
Molecular dynamics study of optimal packing structure of OTS self-assembled monolayers on SiO2 surfaces
Optimal packing structure of Octadecyltrichlorosilane (OTS) self-assembled monolayer (SAM) adsorbed on a SiO2 (1 0 0) surface with a Si substrate was studied performing molecular dynamics (MD) computational simulations.
Aldizkaria/Liburua
Tribology International
2007-06
Orrialdeak
Volume 40, Issue 6, June 2007, Pages 960–966
S. Merino, A. Retolaza, A. Juarros, S. Landis.
A new way of manufacturing high resolution optical encoders by nanoimprint lithography
A process based on nanoimprint lithography is proposed to manufacture linear encoders with a pitch below 1 μm.
Aldizkaria/Liburua
MicroelectronicEngineering, 84, 848-852 (2007)
2007S. Merino, H. Schift, A. Retolaza, T. Haatainen.
The use of automatic demolding in nanoimprint lithography processes
Three different setups for automatic demolding in nanoimprint, including air induced demolding and fast and slow demolding, are studied for different stamps designs, and compared with standard manual demolding.
Aldizkaria/Liburua
MicroelectronicEngineering, 84, 958-962 (2007)
2007